YINCAE’s DA158N die attach material withstands -273 ° C

This material can be used for all die attach applications, especially for harsh conditions. It is also suitable for bare chip protection in various advanced packages such as memory cards, chip carriers, hybrid circuits and multi-chip modules.

It is designed for high production and friendly environments where process speed and reliability are important concerns. This material is easy to distribute, minimizes evoked stresses, provides excellent reliability performance (such as temperature cycle performance), and provides excellent mechanical resistance.

For more information on YINCAE’s DA158N die attach materials, or for more information on the YINCAE product range, please email us at: info@yincae.com..

You can also visit the following website to find out more information: www.yincae.com

http://smttoday.com/2022/03/30/yincaes-da158n-die-attach-materials-withstanding-273c/ YINCAE’s DA158N die attach material withstands -273 ° C

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