Techsil Launches Innovative Lightweight Foam at Design Engineering Expo – Electronics World

Design engineers in the EV and AV markets are sought after to save weight. Techsil is excited to launch two pioneering lightweight grades that will revolutionize the potting and encapsulation of the automotive industry.

At the Design Engineering Expo in June, Techsil will showcase advanced thermal management solutions along with highly exciting lightweight silicone and polyurethane foams. These innovative lightweight foams are set to revolutionize potting and encapsulation in the automotive industry, especially in the emerging EV (electric vehicle) and AV (self-driving car) markets.

Up to 75% of fuel consumption is related to vehicle weight. Design engineers are facing the impetus for weight reduction, and Techsil is excited to offer these new pioneering products when the market needs them.

In addition to being super lightweight, foam can form very quickly. They provide excellent protection for electrical devices. It comes with an easy-to-use mixing ratio, making it ideal for high volume automated production lines.

Techsil’s most exciting PU foam is the grade already produced in the market-leading carbon fiber spoilers for electric vehicles. It is a rigid closed cell, 10 lb density foam system that flows very well into the mold cavity and has excellent physics when cured.

Silicone Foam is a variable density flame retardant foam system that has just undergone vigorous testing for potting 3D printed parts. In this application, the material of choice must act as an ultra-lightweight gap fill to provide flood protection for electrical devices. This product delivers excellent performance and overcomes multiple assembly problems. It forms very quickly, is very versatile, cures at room temperature, and for this application it is injected into the mold.

Both Technical Sales Manager Adam Johnson and Business Development Manager Tim Johnson will be attending the NEC8 Design Engineering Expo.th And 9th June. Find them on the stand K2, find out more, and see how Techsil can help.


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https://www.electronicsworld.co.uk/techsil-to-launch-revolutionary-lightweighting-foams-at-the-design-engineering-expo/33896/ Techsil Launches Innovative Lightweight Foam at Design Engineering Expo – Electronics World

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