SHENMAO Launches State-of-the-Art Low Temperature Lead-free Solder Wire PF735-LT201

SHENMAO America, Inc. is pleased to announce the availability of the PF735-LT201 low temperature lead-free no-clean solder wire. This advanced solder wire is designed to meet the evolving needs of the electronics industry, providing superior solderability and reliability for low temperature PCBA soldering and rework processes.

The development of the PF735-LT201 was born out of a comprehensive understanding of industry trends and challenges. As the demand for ultra-thin packages increases, the risk of package warpage increases, leading to lower production yields. SHENMAO’s innovative solution addresses this problem by offering low melting point, lead-free no-clean solder wires optimized for low temperature PCBA soldering and rework processes.

The PF735-LT201 wire solder sets a new benchmark in soldering technology with a range of great features. By blending a special low temperature rosin and an activator, the thread solder achieves excellent solderability and achieves optimum adhesion and strong joints. The soldering process with PF735-LT201 produces a colorless flux residue due to the special surfactants involved.

The PF735-LT201 is halogen-free (ROL0) and fully compliant with RoHS, RoHS 2.0, and REACH regulations, in line with SHENMAO’s commitment to environmental responsibility. The PF735-LT201 reduces solder splashes and fumes, improves the work environment, and provides excellent solder joint strength, reliability, and resistance to thermal and mechanical fatigue.

SHENMAO’s LTS materials have the unique ability to lower reflow temperatures, thereby reducing PCB and board deformation. This increases production yields and improves quality standards.

Discover the cutting edge PF735-LT201 solder wire and experience the future of low temperature soldering. Learn more about. www.shenmao.com.