SHENMAO Debuts Visible No-Clean BGA Flux SMBF-08 for Enhanced SMT Assembly and BGA Ball Mount Processes

SHENMAO America, Inc. is proud to announce the release of our new SMBF-08 Visible No-Clean BGA Flux. This innovative flux is specifically designed to meet the demands of surface mount technology (SMT) assembly and BGA ball mount processes, improving visibility and performance.

A key feature of SMBF-08 flux includes a visible black color that allows for easy identification and evaluation during automated optical inspection (AOI) processes. Unlike traditional clear BGA fluxes, SMBF-08’s visible black residue is easily detectable, providing customers with an efficient way to evaluate flux applications.

In addition to improved visibility, SMBF-08 is halogen-free (ROL0) and fully compliant with RoHS, RoHS 2.0, and REACH regulations. This ensures environmental compatibility and compliance with industry standards.

SMBF-08 is a highly versatile flux suitable for various processes such as stencil printing, dipping, and pin transfer. Its excellent printability, wettability and solderability make it highly effective in a wide range of IC packages including System in Package (SIP), Wafer Level Package (WLP) and flip chip technology.

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