Two weeks ago, Koh Young, industry leader in True3D measurement-based testing Solution hosted the first session of the Koh Young Future Forum 2022 Online Seminar Series.Ko Young Expert Panel Introducing the award-winning Neptune series for Dispensing Process Inspection (DPI).It was a great success Overwhelming interest and excitement from the participants, especially during the live Q & A session.
Based on the success of the DPI seminar, I would like to introduce you to the next session. “Faster, smaller, denser: inspection Semiconductor packaging. “ The session is scheduled for May 26, 2022 and wev will present materials in multiple languages to support global users. Anne Kim, a technical support professional at Koh Young Technology, hosts an online seminar on challenging semiconductor package inspection.
This session goes beyond explaining technologies and trends to address the challenges and solutions of specific real-world applications. Participants will see trends in the world of semiconductor packaging with media processing, measurement accuracy, details and technology-focused content extensions such as 2.5D / 3D packaging technology, and introductions of semiconductors and advanced packaging inspection solutions. Understand. The Meister series provides versatile and optimized measurement-based inspection while ensuring a high standard of quality and throughput for outsourced semiconductor assembly and test (OSAT) companies, device or module manufacturers, foundries and more. ..
Co-Young experts will support live Q & A sessions following the webinar.Sign up for your second online seminar now “Faster, Smaller, Higher Density: Inspection of Semiconductor Packages” Click at your favorite time “register now” Please link or visit our website kohyoung.com. Webins include two English sessions spanning different time zones and Korean, Chinese, and Japanese webins.
http://smttoday.com/2022/05/14/koh-young-announces-the-second-session-of-its-future-forum-webinar-series-will-focus-on-semiconductor-advanced-packaging-inspection-2/ Koh Young Announces Second Session of Future Forums Webinar Series Focuses on Semiconductors and Advanced Packaging Inspections