Intel signs 3nm contract with TSMC this month, pilot production begins

TSMC has begun pilot production of the next generation 3 nanometer semiconductor manufacturing node. The report, courtesy of Taiwanese publication Digitimes, reports that executives from US chip giant Intel Corporation will visit Taiwan later this month to complete orders for the 3nm process. TSMC’s manufacturing technology is often limited in capacity early in the life cycle, and very few companies can procure products manufactured through TSMC.

A report that believes TSMC’s first 3nm capacity will be limited to 40,000 wafers per month

Report on 3nm pilot production Samsung Foundry, the semiconductor manufacturing division of TSMC and the Samsung Group, a chaebol in South Korea, is struggling with an estimated mass production schedule for next-generation semiconductor manufacturing technology. Samsung expects the 3nm process to be ready in the first half of next year, but TSMC CEO Dr. CC Way has outlined that his company will go into mass production in the second half of 2022.

Intel’s chief says Taiwan’s instability is demanding subsidies to American chip makers

TSMC’s 3nm pilot production kick-off meets Dr. Wei’s estimate given earlier this year at the behest of investors. His company sells the most advanced manufacturing technology to date and believes that it will be able to profit from it in the coming years.

Transistors continue to shrink in size, and it will take years for chip manufacturers to develop new technologies, even though TSMC claims to be in orbit. Double the performance of process technology Every two years.

Moreover, @chiakokhua On Twitter, Intel wants to confirm that this is the first product to procure TSMC’s 3nm product. It is generally believed that the freshest silicon from the Taiwanese company’s production line will be sent to Cupertino’s technology giant Apple, Inc, which retains its technical advantages in smartphones and notebooks. Use them to do.

TSMC presentation slides outlining the roadmap for semiconductor manufacturing processes. Image: TSMC

According to @chiakokhua, who also quotes Digitimes:

Intel executives will visit Taiwan in mid-December.

-Determine the scope of cooperation with TSMC.

-Request / confirm that N3 capacity is not affected by Apple.

-Start discussions on N2 cooperation.

-The first wave with N3 capacity less than 60K only reaches 40K + wpm in 1H’23.

Along with Santa Clara’s semiconductor designer Advanced Micro Devices, Inc (AMD) and San Diego’s company Qualcomm Incorporated, rumors of companies seeking the top spot for the latest chip technology from TSMC have long surfaced. Both rumors Prefer Samsung’s 3nm process over Taiwanese process.

Intel ARCA380 discrete graphics card.128 EU clocked up to 2.45GHz and 6GB GDDR6 memory, performance equivalent to GTX 1650 SUPER

More interestingly, the company in Santa Clara, California is also planning its own 2nm node, demonstrating Digitimes’ belief that Intel will also discuss collaboration with TSMC in the 2nm process. This technology, called 20A (Angstrom), has the potential to appear on the production line in 2024. Intel’s roadmap announced in July This year.

This could be a year earlier than TSMC’s 2nm node. It can be put into production in 2025 if: Estimate of the back of the hand What was given by Dr. Wei turned out to be accurate.

Intel’s cooperation with TSMC Reported on 3nm process After January 2021, And that The latest report suggests This pair works with a graphics processing unit (GPU) and three data center central processing units (CPUs).Both have not yet solidified their position in the fast-growing GPU market and are important products for Intel, which is competing with AMD in the data center segment, the latter consistently. Show strong continuous and annual revenue growth Within the segment. Intel signs 3nm contract with TSMC this month, pilot production begins

Back to top button