Infineon’s New HYPERRAM™ Memory Chip Doubles Bandwidth for Low Pin-Count High-Performance Solutions –

Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has added HYPERRAM™ 3.0 to its portfolio of high-bandwidth, low-pin-count memory solutions. The device features a new 16-bit enhanced version of the HyperBus™ interface, doubling throughput to 800 MBps. With HYPERRAM 3.0, Infineon offers a portfolio of high bandwidth memories with low pin count and low power. Applications that require extended RAM memory, such as video buffering, factory automation, artificial intelligence of things (AIoT), automotive vehicle-to-everything (V2X), or scratch pad memory for intense mathematical calculations ideal for applications that .

“With nearly 30 years of knowledge in memory solutions, we are excited to bring to market a new product that is an industry first. It delivers high throughput per pin,” said Ramesh Chettuvetty, Senior Director of Applications and Marketing, Automotive, Infineon. “Our low-power features improve power consumption without sacrificing throughput, making this memory ideal for industrial and IoT solutions.”

Infineon’s HYPERRAM is a standalone PSRAM-based volatile memory that offers a simple and cost-optimized way to add extended memory. It has the same data rate as SDR DRAM, but has much fewer pins and lower power requirements. The increased data throughput per pin of the HyperBus interface enables the use of lower pin count microcontrollers (MCUs) and fewer layer count PCBs. This reduces complexity and provides opportunities for cost-optimized designs to support target applications.

About Hyperram

Infineon announced its first generation HYPERRAM devices supporting HyperBus interface in 2017. The second generation of his HYPERRAM devices will be introduced in 2021 and with data rates up to 400 MBps he will support both Octal xSPI and HyperBus JEDEC compliant interfaces. Third generation HYPERRAM devices support a new enhanced HyperBus interface that allows data rates of 800 MBps. HYPERRAM devices are available in densities ranging from 64 Mb to 512 Mb. They are AEC-Q100 qualified and support industrial and automotive temperature grades up to 125°C.


HYPERRAM 3.0 products are available now in the BGA-49 package. For more information, please visit Infineon’s New HYPERRAM™ Memory Chip Doubles Bandwidth for Low Pin-Count High-Performance Solutions –

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